Novellus Systems manufactures, markets and services advanced automated wafer fabrication systems for thin film deposition, surface preparation and CMP. Our chemical vapor deposition (CVD), physical vapor deposition (PVD), copper Electrofill™, photoresist and residue removal and CMP systems are being used worldwide for volume production of high-quality semiconductors at the lowest overall cost. We invite you to learn more about Novellus innovations in CVD, PVD, Electrofill, Surface Preparation and CMP technology. Manufacturers use our CVD processes for dielectric deposition of insulation thin films and metal deposition of conductive thin films. The PVD process employs advanced sputtering techniques to apply an ultra-thin metallic film to the surface of a wafer. The superior properties of the Electrofill process are made possible by variable electrical waveforms, advanced chemistries and innovations in the wafer fixture and field shaping elements. Additionally, having a prepared surface
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