ReVera Overview
ReVera is a leading provider of next generation metrology used to monitor and control films and critical layers deployed in the semiconductor manufacturing process. For many years, the industry has relied on optical-based technologies to measure thin films and layers in semiconductor devices. Due to the limitations of optical techniques when presented with smaller features and more complex...More»
ReVera is a leading provider of next generation metrology used to monitor and control films and critical layers deployed in the semiconductor manufacturing process. For many years, the industry has relied on optical-based technologies to measure thin films and layers in semiconductor devices. Due to the limitations of optical techniques when presented with smaller features and more complex materials, device manufacturers are spending an ever increasing portion of their capital dollars on new metrology technology such as that provided by ReVera. This transition away from optical metrology is increasing as the industry moves through each successive technology node. ReVera is recognized as the supplier of choice of this next generation metrology, having been adopted by the majority of leading edge device manufacturers.«Less
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Funding
| Date | Type | Capital Amount | Post-Money Valuation | Investors |
|---|---|---|---|---|
| 03/28/2005 | Series B | 11.2M | Unknown |
Products
| Name: | VeraFlex |
| Product URL: | http://www.revera.com/VeraFlex/products1.htm |
| Description: | The VeraFlex materials metrology system is a flexible, product wafer, non-destructive system that meets the increasing demands for advanced materials metrology. VeraFlex provides the capabilities needed to address ultra thin film and atomic level materials requirements for next generation semiconductor production. Installed and operating in production fabs, VeraFlex is used to monitor, measure and control critical materials processes. New VeraFlex applications continue to be developed to meet customer challenges for 65 nm, 45 nm and beyond. |
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