Ziptronix Overview

Setting the next generation standard for the manufacturing of integrated circuits, Ziptronix' mission is to deliver innovations to the electronics industry, and continually advance the way semiconductor products are designed and manufactured.

Ziptronix lowers the high manufacturing and packaging costs and increases the yield associated with high-speed logic and MEMS manufacturing. Ziptronix’...More»

Setting the next generation standard for the manufacturing of integrated circuits, Ziptronix' mission is to deliver innovations to the electronics industry, and continually advance the way semiconductor products are designed and manufactured.

Ziptronix lowers the high manufacturing and packaging costs and increases the yield associated with high-speed logic and MEMS manufacturing. Ziptronix’ Direct Bond Interconnect (DBI™) technology enables silicon to be bonded in a 3D fashion to maximize the density of signal paths that chips use to interconnect transistors. DBI™ maximizes the electrical connections between the separate components and extends bandwidth by alleviating the interconnect delays with scalable 3D routing. Ziptronix technologies are enabling the creation of true 3D integrated circuits at the gate level by delivering significant advantages including: size reduction, drastically reduced production costs, lower power consumption and increased system speed and performance«Less